Semiconductor Industry
Material
Quartz Glass (HV700)
Industry
Semiconductor Manufacturing
Challenges
- Low machining efficiency
- Hole edge chipping in traditional drilling
Solution
- Ultrasonic Engraving & Milling Center (UEM-600
- Ultrasonic machining system
- Solid PCD drill
Results / Benefits
- Continuous drilling of 1,200 holes
- 72% reduction in cycle time (270s → 75s per hole)
- 68% reduction in hole edge chipping
Material
Alumina Ceramic
Industry
Semiconductor / Advanced Ceramics
Challenges
- Low machining efficiency
- Short tool life
- High scrap rate due to micro-cracking
Solution
- Ultrasonic Engraving & Milling Center (UEM-800)
- Integrated ultrasonic machining system
Results / Benefits (Key Highlights)
- Improved machining efficiency
- Better chip evacuation
- Reduced surface micro-cracking
- 40% reduction in surface roughness
Aerospace Industry
Material
TiAl Alloy
Industry
Aerospace
Challenges
- Short tool life due to hard-to-cut, low-density, high-hardness material
- Unstable dimensional accuracy
- Tight tolerance control between blade concave and convex surfaces
Solution
- Ultrasonic Vertical 5-Axis Simultaneous Machining Center (MVC400-5AXIS)
- Ultrasonic machining system
- Ultrasonic through-coolant shrink-fit tool holder
Results / Benefits (Key Highlights)
- 2× increase in tool life (4 slots → 12 slots)
- Improved surface compressive stress
- Enhanced fatigue strength and corrosion resistance
Material
Superalloy (GH4169)
Industry
Aerospace
Challenges
- Thin walls with high chord-thickness ratio (>40:1)
- Blade displacement and uneven blade edges
- Poor surface finish with chatter marks
Solution
- Ultrasonic Vertical 5-Axis Simultaneous Machining Center (MVC400-5AXIS
- Ultrasonic machining system
- Supercritical CO₂ cryogenic cooling (-78 °C)
- Minimum Quantity Lubrication (MQL)
- Ultrasonic through-coolant shrink-fit tool holder
- Through-coolant tapered ball end mill with annular air cooling
Results / Benefits (Key Highlights)
- Reduced chatter and improved contour accuracy
- 56% improvement in surface finish
- Surface roughness reduced from Ra 0.93 µm to Ra 0.408 µm
- Reduced polishing and finishing time